3C Chip Drop Impact Pressure Analysis

As one of the components of the chip, the heat sink needs to be assembled with the chip as a complete set. During transportation and installation, un- controllable factors can cause the chip to fall instantly, resulting in damage to the chip caused by the heat sink, thus affecting the normal use of the chip.

The thin-film sensors are installed in the chip package, and after connecting the equipment, the complete set of routers is packed and dropped through the dropping machine for different heights and different speeds.

Compared to traditional pressure sensitive paper measurement, the picture is clearer and the high frequency acquisition expands the measurement direction. The data from drop measurement verifies the feasibility of the mounting solution and improves the integrity of the chip during transporta- tion and installation.