Semiconductor Wafer Lamination Pressure Mapping

Along with the chip size is getting smaller and smaller, the wafer diameter is increasing, and the difficulty of multiple wafer lamination increases. In order to realize multi wafer lamination, the surface of the wafer must have ex- tremely high flatness, smoothness and cleanliness. Customers need our pres- sure distribution measurement equipment to verify the parallelism of the wafer placement equipment during dispensing.

The sensor is placed between two wafers to simulate wafer lamination and test the pressure distribution during lamination to verify the parallelism of the wafer placement equipment.

Through the test of our distributed pressure measurement system, custom- ers intuitively and clearly understand the parallelism of the equipment, but also test the flatness of the wafer itself. Provide data reference for customers to upgrade equipment later.